TO-247 30mm Aluminum Cooling Fin Heatsink

11.00

A compact, durable aluminium heat sink designed specifically for TO‑247 power packages, also compatible with TO‑220 packages. The extended 30 mm fin stack maximizes surface area for rapid heat dissipation, ensuring reliable operation and extended component lifespan in demanding, high-power applications.

200 in stock

Quantity Discount (%) Price
1 - 10 11.00
11 - 20 3 % 10.67
21 - 50 6 % 10.34
51+ 9 % 10.01
SKU: TM-HST247F-30 Categories: , , Tag:

Description

Technical Overview of the TO-247 30mm Cooling Fin Heatsink

The TO-247 30mm Cooling Fin Heatsink is a heavy-duty thermal management solution designed for high-power semiconductors that operate under demanding conditions. As power electronics become more compact, managing the heat generated by TO-247 packaged components like MOSFETs, IGBTs, and Rectifiers becomes a critical challenge. This 30mm extended-height heatsink provides a significantly larger surface area compared to standard sizes, allowing for superior heat dissipation. At BuyCircuitParts, we supply these premium TO-247 30mm Cooling Fin Heatsink units to help professionals and hobbyists keep their high-wattage systems stable and “on track.

Key Specifications and Physical Dimensions

To ensure this heatsink fits within your mechanical constraints while providing maximum cooling, here are the technical details for the TO-247 30mm Cooling Fin Heatsink:

  • Material: 6063-T5 High-Thermal Conductivity Aluminum.

  • Compatibility: Specifically sized for TO-247, TO-3P, and TO-218 packages.

  • Height: 30mm (Extended height for increased thermal mass).

  • Fin Design: Multi-slot vertical fins to maximize air contact.

  • Mounting Type: Pre-drilled screw hole for secure component attachment.

  • Surface Finish: Anodized for enhanced emissivity and corrosion resistance.

  • Weight: Optimized to provide cooling without overstressing PCB solder joints.

Why the 30mm Profile is Essential for High-Power Stages

In power electronics, the junction temperature is the enemy of longevity. The TO-247 30mm Cooling Fin Heatsink offers an advantage by providing a 30mm vertical chimney. This extra height allows the heatsink to capture more airflow and dissipate more Watts per degree Celsius than smaller 20mm or 25mm versions. For circuits running at high switching frequencies or those housed in restricted enclosures, the extra mass of the 30mm aluminum profile acts as a thermal buffer, absorbing sudden heat spikes and releasing them slowly. At BuyCircuitParts, we ensure the mounting face is precision-flat to minimize the thermal resistance path.

Common Applications for the TO-247 30mm Heatsink

The TO-247 30mm Cooling Fin Heatsink is the go-to choice for several high-energy applications:

  1. Industrial Inverters: Cooling the primary switching IGBTs in high-voltage DC-to-AC converters.

  2. Uninterruptible Power Supplies (UPS): Managing the heat of large MOSFETs during battery backup operation.

  3. Electric Vehicle (EV) Chargers: Cooling the power rectification stages in fast-charging modules.

  4. High-End Audio Power Amps: Providing silent, fan-less cooling for class AB or class D amplifier output transistors.

  5. Bench Power Supplies: Cooling the pass transistors in high-current adjustable power units.

Professional Installation for Maximum Efficiency

To get the most out of your TO-247 30mm Cooling Fin Heatsink, follow these best practices:

  • Thermal Interface Material (TIM): Because TO-247 components often dissipate 50W or more, use a high-performance grease like our Heat Sink Thermal Paste 50g to bridge the gap between the component and the 30mm fin.

  • Orientation: Install the heatsink with the fins running vertically. This promotes natural convection, allowing hot air to rise through the 30mm channels effectively.

  • Mechanical Tension: Ensure the mounting screw is tightened to the manufacturer’s recommended torque. Over-tightening can warp the tab, while under-tightening creates a “heat bottleneck.

  • Isolation Pads: If your design requires electrical isolation, use high-quality Sil-pads or ceramic insulators specifically cut for TO-247 footprints.

Why Choose BuyCircuitParts for Thermal Solutions?

As a specialized seller, we understand that thermal management is not an area where you can cut corners. A subpar TO-247 30mm Cooling Fin Heatsink with poor alloy purity will fail to move heat fast enough, leading to expensive component failure. At BuyCircuitParts, we source heatsinks made from high-purity aluminum with consistent fin thickness. We inspect every batch for burr-free edges and flat contact surfaces. With our commitment to fast shipping and expert-level sourcing, we are here to provide the hardware that keeps your most critical systems “on track.

Durability in Challenging Environments

The 30mm profile is not just about cooling; it’s about durability. The thicker base and robust fins of our TO-247 30mm Cooling Fin Heatsink make it resistant to the vibrations often found in industrial machinery and automotive electronics. The anodized protective layer prevents the aluminum from oxidizing in humid or salty air, ensuring the thermal performance doesn’t degrade over time. By choosing this premium cooling solution from BuyCircuitParts, you are protecting your investment in high-power semiconductors for years to come.

📐 Approx Dimensions:

Body Height: ~30 mm
Body Width: ~33 mm
Body Depth (Fin Depth): ~16 mm
Mount Hole Diameter: ~3 mm (standard M3 screw fitting)
Blade Thickness: ~1 mm
Weight: ~20–22 grams

🧊 Note:
Product colour and markings may vary slightly based on manufacturer and batch. Functionality is guaranteed. (Refer to the product image for illustration only. For precise specifications, consult the datasheet.) For more information on thermal management theory, visit the Heat Sink Engineering Guide..

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Additional information

Weight20 g
Dimensions1.6 × 3.3 × 2.5 cm
HSN

76169990

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